Engineering Director

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  • R47365F97

  • 海外

  • 中高階

  • 光電產業

  • 半導體設計

  • General Description:
    Leading PE, ME teams for chip manufacturing and CR design modification, overall responsible for successful product process (including MO, wafer & chip processing) transfer from Taiwan plant to China local plant, oversee New Product Introduction of next generation chips, establish standard work process, sustain and improve production output yield through continuous process variation control, equipment TPM and utilization of MES system. Continue to improve engineering team’s capability and process of applying DIVE (a root-cause analysis tool) to truly find root causes of any deviation of processes, lower than standard yield or line down and to develop preventative actions of any future repeats.
    The candidate will need III- V group compound semiconductor processes experience.
    Key Responsibilities:
    - Responsible for transferring existing manufacturing processes for selected products from Taiwan plant to China for mess production, including but not limited to putting in place standard SOP, WI for each station, and all engineers trained to do their jobs, and engineers are qualified to train operators;
    - Responsible for customizing machine maintenance requirement based on TW recommendation and continue to define new critical control parameters for each major equipment;
    - Responsible for recommending new equipment through market research, available manufacturing technologies, vendor comparison, cost and efficiency comparison etc.
    - Improve sustainability and develop best practices within the production process; Lean shall be the foundation for production process and setup
    - Responsible for continuous improvement of equipment utilization (TEEP), First Pass Yield, Final Yield, manufacturing lead time, product cost reduction, operator routing time reduction and overhead reduction;
    - Team up with Planning and Production to control WIP and engineering development inventory
    - Manage and develop PE and ME engineering teams and control department budget
    - Responsible for providing on-site supervision of product development teams while PD directors will be responsible for technical management (mainly referring to product development tools/processes, and technology strategy)
    - Support and early involvement with product development team when new chips are under development and requires manufacturing process development and special R&D order/experiment execution
    - Conduct analysis on competitor products and support development of external component sales business as needed

  • NTD / 面議 (經常性薪資達4萬元或以上)

  • 勞、健保 / 勞工退休金提撥 / 依法令規定之相關福利

  • 供宿

  • Technical Qualification:
    - Strong technical background in semi-conductor laser are required;
    - 10+ years experience in semi-conductor laser industry, III- V group compound semiconductor process engineering experience is must, the experience and knowledge of In, Ga, As, is preferred
    - Working location preferred: China

  • 大學以上

  • 需負擔管理責任

  • 需外派

  • 日班

  • 周休二日

  • 1人

  • 2020 / 10 / 15


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